Abstract:In this paper, diallyl bisphenol A and N,N’-(4,4’-diphenylmethane)bismaleimide were used to
modify bisphenol A discyanate ester to improve process capability and heat resistance. Cure behavior and heat resist-
ance of the modified resin was investigated by differential scanning calorimetry(DSC), thermogravimetric analysis
(TGA) and dynamic mechanical analyzer (DMA). In addition, mechanical properties and dielectric properties in
high frenquency of the resin were also investigated. The result indicated that DSC result showed that the temperature
of the curing reaction of modified resin was lowedca 60℃. TGA results showed 5% weight loss temperature were about
400℃. DMA results showed the inflection point of tanδare about 270℃. In 7 to 15 GHz, the dielectric constant <3,
dielectric loss 0. 008 to 0. 01, showing a good dielectric properties.
