Abstract:A heat-resistant putty for sealing ceramics was prepared by dopping organic silicone with inorganic
particles. The adhesion properties, coefficient of thermal expansion and thermal shock resistance were studied. SEM
and XRD were used to analysis microstructure and phases. The results show that heat-resistant putty has excellent adhesion
and thermal shock resistance. While bonding C/ SiC, the single lap shear strength is 5. 5 MPa, and 1. 8 MPa
at 1 200℃. The putty can also bond and seal multiple materials such as the aerogel,C/ C materials. The putty has
characteristic of low expansion, and with good thermal expansion match withl C/ SiC. At high temperatures, the putty
generated Al2O3·(B2O3)n . It can absorb thermal shock, and can enhance interface strength. At the wind tunnel environment,
average surface temperature is 1 200℃,and maximum temperature is 1 400℃. The apparece of specimens
is complete with no cracking after the wind tunnel test.
