Abstract:Ti53311S alloy was successfully joined by TLP bonding with Cu filler metal. The interfacial microstructure
was characterized by SEM and EDS. Effects of TLP bonding temperature and holding time on the joint microstructure
and mechanical properties were investigated in details. The results showed that the typical interfacial microstructure
was Ti53311S/ β-Ti/ Ti,Cu(Sn) intermetallic compound/ β-Ti/ Ti53311S. The mutual diffusion degree between
base metal and Cu interlayer increased with the rise of TLP bonding temperature and increase of holding time,
which caused the increase of the joint width and reduction of compound in the joint. The degree of diffusion affected
the strength of the bonding greatly. The tensile strength of joints increased at first gradually and then tended to be stable
at room temperature. The highest tensile strength, which was achieved at the bonding temperature of 980℃ holding
for 20 min, was 899 MPa.
