Abstract:Based on the arts and crafts principles of electronic parts, the solidification processes of MD-130 adhesive
were systematically investigated and the space adaptability was valued. Results showed the optimal solidification
parameters are on 150℃ for 60 minutes, which showed up to 18 MPa in shear strength. Thermal shock and low
density particle radiation led to better solidification and mechanical performance. However, overdosed radiation triggered
the degradation, which made the mechanical strength reduced. After the environment experiments, MD-130
adhesive indicated good properties, which can meet the designing requirements.
