Abstract:The performance and the microstructure analysis were carried out on 62Sn36Pb2Ag solder and
63Sn37Pb solder used in silicon battery of analog sun sensor by mechanical test and accelerated thermal cycle test.
Results show that the granulated Ag3Sn plays the role of dislocation pining effectively in 62Sn36Pb2Ag solder because
of the addition of Ag element. In strengthening the joints, the granulated Ag3 Sn also improves the resistance to the
thermal mismatch and the creep of the solder. After experiencing mechanical test and the temperature cycle test from
-105 to +105益, the crack growth rate of 62Sn36Pb2Ag joint is much less than the 63Sn37Pb joint. Under the cer鄄
tain test condition in the article, the resistance to the thermal mismatch and the creep of 62Sn36Pb2Ag is better than
63Sn37Pb solder.
