Curing Properties of Tetraphenol Ethane Epoxy Resin

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Curing Properties of Tetraphenol Ethane Epoxy Resin
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Abstract:

This paper focus on studying the effects of two different curing agents (tetrahydromeythyl-1,3-iso鄄

benzofurandione MeTHPA, and 4,4-diaminodiphenyl sulfone DDS) on curing reaction and curing properties of 1,1,2,

2-tetrakis(4-hydroxyphenyl)ethane tetraglycidyl ether(TGE). The curing behavior of the TGE was characterized by

scanning calorimetry analysis (DSC). The results demonstrated that curing reaction activating energy of two epoxy res鄄

in/ hardener systems were 65.8 kJ/ mol and 68.4 kJ/ mol, respectively. The curing resin thermal properties and mechan鄄

ical properties were investigated by dynamic mechanical analysis (DMA), thermal gravity analysis (TGA) and universal

testing machine, respecticaly. The glass transition temperature(Tg) of MeTHPA system is 188益. Tensile and flexural

strength is 33 MPa and 48 MPa. The Tg of DDS system is 203益. Tensile and flexural strength is 61 MPa and 93 MPa.

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Online: November 28,2016
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