Abstract:In this work, the pulling test condition and test results of M5 post-insert through-hole connector in a
honeycomb panel were discussed. The influence of post-insert connector application and curing processing protocol on
the pulling strength and bonding quality were analyzed. It was found that the best way to apply the resin is to install
the inserts after vertically fill the resin along the axial of the through holes. Minimum pores and improved pulling
strength were achieved with this method. For EA934NA post-insert bonding agent, curing at room temperature ( ≥
22℃) is preferable for better pulling strength. The conclusions of this work can be used as references for future product
test design and processing configuration setup.
