Abstract:Since the adhesive is located between two layers of material, the internal structure of the adhesive
debonding process is often difficult to detect. In this paper, three kinds of adhesives’ plate samples and the Ushaped
samples were made, the mechanical properties of tensile and shear state were tested and the corresponding
strain energy release rate were calculated. VCCT technology was used, the fracture and debonding area were predefined,
the cracking and debonding process of the adhesive in a tensile and shearing state were simulated. By contrasting
the maximum stress and maximum displacement obtained by numerical simulation and experiments, it was indicated
that the VCCT technology could effectively predict fracture critical load of these three adhesive, and show that this
method could obtain the expansion process of debonding area. This laid a good foundation for the study of complex
structures’ debonding process.
