Fourier transform infrared spectroscopy was used to characterize the structure of the KH-550. The
bonding strength between Al and the adhesive was studied by the pretreatment with different concentration coupling agents.
The interface bonding of Al/ epoxy resin adhesive system was studied using SEM and RA-IR. It was found that
coupling agent had very strong hydrolysis ability and was able to increase the bonding strength 2 to 3 MPa.