For the purpose of welding lead-free BGA devices, among three main welding processes, lead-free
BGA reflow with Sn-Pb solder paste is chosen as process method. By adjusting the temperature zone reflow oven parameters
in order to get the approach of the temperature curve, and by looking at the appearance, X-ray, dye penetrant,
shear stress,metallographic, the conclusion can be made that lead-free BGA soldering technology with SnPb
solder paste passes through test. The result shows that the process method of lead-free BGA reflow with SnPb solder
paste can manage to weld lead-free BGA devices. The result shows that the method is reasonable an feasible.