Quantitative Measurement for Disbanding Defect Using Shearography
DOI:
Author:
Affiliation:

Clc Number:

Fund Project:

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    The disbanding defect is prone to be produced during adhesive bonding process. The integrality,
    strength and rigidity of product would be broken by disbanding. Investigating the capability of quantitative measurement and accuracy of shearography method is more impotent to ensure the product quality and testing efficiency. This paper presents the test principle of shearography, the characteristic acceptance specification of disbanding defect. The detecting sensitivity and accuracy of quantitative measurement is investigated when sheargoraphy method is used for inspecting disbanding on honeycomb structures. The quantitative measurement result shows that the measurement result is equal to the trim size and the accuracy is less than 10%. The shearography method could be used for inspecting the
    honeycomb structure products.

    Reference
    Related
    Cited by
Get Citation
Share
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:
  • Revised:
  • Adopted:
  • Online: November 28,2016
  • Published: