Progress of Thermal Interface Materials

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Progress of Thermal Interface Materials
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Aerospace Research Institute of Materials & Processing Technology,Beijing
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Abstract:

Thermal interface materials (TIMs) are commonly used to reduce the thermal resistance between an
electronic device and its cooling solution. This paper summarizes the progress in the design,composition,properties and
application of TIMs in microelectronics. Finally,the developing trend of the technique is also pointed out.

Key words:Thermal interface materials,Thermal conducting,Thermal impedance,Thermal conductive grease,

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