Based on the project development requirements of Fast，Intelligent，and Cheap for satellite subsystems，research was conducted on assembly process technology for an onboard ultra-high-frequency MCM （Multi-Chip Module）receiver component.Through structural layout，selection of materials and devices，and process-flow design，and together with targeted advances on key steps such as connector sintering，substrate sintering，and die attach，a viable manufacturing route for spaceborne EHF products was established.The approach resolves the thermal mismatch between the RF insert and the aluminum housing，achieving an assembly accuracy of 50 μm.Relative to conventional spaceborne MCM modules，the product’s cost is reduced to one-fifth，production efficiency is doubled， and the automation level reaches 90%，thereby meeting the goals of Fast，Intelligent，and Cheap development. The product has been successfully deployed on satellites and has entered mass production.