Rearch on the Accelerated Aging and Life Prediction of Phenyl Silicone Rubber in the Environments of Heat and Humidity
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1.Aerospace Research Institute of Materials & Processing Technology,Beijing 100076;2.China Academy of Launch Vehicle Technology,Beijing 100076

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TQ330

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    Abstract:

    The heat-humidity aging process of phenyl silicone rubber is studied, focusing on its tensile, damping, and compression rebound properties. For tensile properties, experimental studies have shown that the material tensile modulus and 100% fixed elongation stress gradually increases with the rise of temperature or humidity.For the damping property, the loss factor gradually decline with the increase of the temperature or the humidity.For the compression rebound property, the compression compression permanent deformation gradually increases with the increase of the temperature or humidity. Moreover, the effect of the temperature on the properties of phenyl silicone rubber is more significant than that of the relative humidity. This is mainly due to the simultaneous occurrence of side group oxidation and hydrolysis during the aging process, which leads to the simultaneous occurrence of molecular chain crosslinking and breaking. Compared with molecular chain breaking, molecular chain crosslinking plays a dominant role. Finally, the storage life of phenyl silicone rubber under different temperature and humidity environments is predicted using the Peck model.Since the damping performance determines the vibration reduction performance of phenyl silicone rubber, the loss coefficient is used as an evaluation characteristic parameter. The results show that at 25 ℃, when the relative humidity changes between 80% and 40%, the life of phenyl silicone rubber changes between 18 and 39 a. This study helps to further understand the aging process of phenyl silicone rubber and provides a method for predicting the life of phenyl damping silicone rubber under different humid and hot environments.

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History
  • Received:February 13,2022
  • Revised:April 21,2024
  • Adopted:May 25,2022
  • Online: April 29,2024
  • Published: