Effect of Machining Parameters on Surface Quality of Single Crystal Silicon in Laser-assisted Turning
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1.Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology,Kunming 650500;2.Yunnan KIRO Photonics Co. Ltd,Kunming 650217

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TG47

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    Abstract:

    In order to improve the surface quality of single crystal silicon after single-point diamond turning, this paper investigates the influence of laser-assisted turning (LAT) technology on machining quality by analyzing surface roughness, surface morphology and Raman spectroscopy of samples prepared by LAT and conventional turning (CT), respectively. Based on the orthogonal test method, the LAT process parameters of single-crystal silicon were investigated on surface roughness. The influence of each factor on surface roughness was evaluated by variance analysis and range analysis. The results show that LAT can effectively improve machined surface quality and reduce residual stress on material surface compared with CT. The contribution proportions of spindle speed, feed rate, cutting depth and pulse duty cycle to surface roughness were 17.51%,44.48%, 6.69% and 14.70%, respectively. Finally, the optimal combination of machining parameters was determined to be: spindle speed of 4000 r/min, feed rate of 2 mm/min, cutting depth of 5 μm, and pulse duty cycle of 30%, with a high-quality surface with a surface roughness (Rq) of 2.4 nm was finally obtained.

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History
  • Received:December 15,2021
  • Revised:August 18,2023
  • Adopted:June 27,2022
  • Online: December 15,2023
  • Published: December 30,2023