In the conformal phased array radar， the flexible surface T/R module based on LCP substrate was studied in order to solve the problems such as the mismatching between components and the antenna plane and the system instability caused by the increase of plug and unplug of cable connection. The LCP laminating quality control and the chip embedding was investigated. The assembly stress on LCP multi-layer substrate was analyzed with ANSYS. The results show that optimized lamination process with auxiliary material makes the substrate flat without cavity inside. The air tightness of LCP substrate embedded with MMIC is 7.4×10^-7 Pa·m³/s. The simulation results show that the stress increases rapidly between temperature of -55 and 80 degree centigrade when the LCP substrate’s bending angle is greater than 10 degrees. The conformal T/R module remains well performance with LCP substrate bending 10 degrees. The LCP substrate has a good potential in conformal phased array.