Reliability Analysis of Aerospace Microwave Module Connection Technology
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Shanghai Aerospace Electronic Technology Institute, Shanghai 201109

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TN605

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    Abstract:

    For the connection technologies between RF coaxial electrical connectors and microstrip circuit boards in manufacturing process of aerospace microwave components, the principles and characteristics of solder hard connection, Ω-shaped gold-plated copper band connection and gold band cladding welding were analyzed. The process control requirements and considerations of different connection technologies were proposed. The experiments, reliability evaluations and analysis of different connection technologies were carried out with electrical connectors of SMA, including qualification test, electrical properties test and thermal stress simulation. The results show that fatigue striations appear at the joints of solder hard connection after mechanical qualification test and 200 cycles of temperature cycling test, while the abnormity dose not appear in the joints of Ω-shaped gold-plated copper band connection and gold band cladding welding. The electrical properties of gold band cladding welding are similar with hard solder connection, which can meet the service demand basically in the range of 1 GHz to 8 GHz. The electrical properties of the connection of Ω-shaped gold-plated copper band have poor consistency; Maximum thermal stress of the solder joint of solder hard connection is much more than that of Ω-shaped gold-plated copper band connection and gold band cladding welding in the same temperature load, the mechanical design margin of gold-strip cladding welding is much more than that of solder hard connection.

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History
  • Received:August 11,2021
  • Revised:August 11,2021
  • Adopted:August 26,2021
  • Online: September 29,2021
  • Published: