Bonding Process of Polyimide Foam Laminate Structure
Author:
Affiliation:

1.Beijing Spacecraft Factory,Beijing 100094;2.China Aerospace Components Engineering Center,China Academy of Space Technology,Beijing 100094

Clc Number:

V19

Fund Project:

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    The new satellite platform put forward application requirements for polyimide foam with lower thermal conductivity and higher dimensional stability. In order to ensure the reliability of the bonding quality and process feasibility of the polyimide foam sandwich structure, it was necessary to evaluate the agent selection and performance evaluation. In this paper, the silicone rubber (RTV-X, GD414) was tested and discussed. Through the comparison of the mechanical properties, temperature resistance, rheological properties, and 90° peel properties of the adhesive, it was confirmed that the RTV-X adhesive is suitable for bonding process of polyimide foam sandwich structure. Through analysis and verification, the bonding pressure method and bonding pressure were determined, and the high and low temperature mechanical properties and mechanical properties of the specimen after temperature impact were evaluated. It is concluded that with the selection of RTV-X adhesive and positive pressure ≥1kPa, the bonding process of polyimide foam sandwich structure is reliable, and the bonding performance of products is good. The obtained results can provide technological reference for more task requirements of spacecraft products such as deep space exploration.

    Reference
    Related
    Cited by
Get Citation
Share
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:July 01,2021
  • Revised:August 06,2022
  • Adopted:August 02,2021
  • Online: September 02,2022
  • Published: