Due to the traditional hermetic packaging methods would have adverse effects on electronic devices during the packaging process， a new hermetic packaging method based on current assisted sintering of silver paste was proposed， which can be used for the hermetic sealing of the aerospace power discrete device. In this paper， the changes of temperature， microstructure and shear strength of the sintered joint during the process of current assisted sintering of silver paste have been studied. During the process of current assisted sintering of silver paste， the heating rate drops dramatically after the removal of organics. It facilitates the initially separated silver particles to contact with each other. With the prolongation of current-on time， the sintered silver joint becomes denser， which leads to the improvement of shear strength of sintered silver joint. Finally， the sealing performance of sintered joint can meet the requirements of hermeticity.