Bonding Process of Honeycomb Sandwich Panels for Satellite at Room Temperature
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Shanghai Composite Material Science & Technology Co., Ltd, Shanghai 201112

Clc Number:

TB333

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    Abstract:

    The process characteristics of J-133 adhesive sandwich plate at room temperature were compared and analyzed. The suitable process method was selected. The effects of brushing amount, thickness of pressure equalizing plate and pressing pressure on the quality of bonding were studied by orthogonal test. Screen out the optimal process parameters and produced verification parts successfully. The research shows that the best way to apply glue is to “apply the glue on the panel’s adhesive surface, then put a layer of 30 g/ m² carbon fiber felt on the glue and brush the remaining glue”; the maximum effects on 90°peeling strength of honeycomb sandwich plate is the thickness of the plate, the second effects is the amount of brush and the pressure is the least; the best process parameters is that the amount of brush glue is 350 g/m²,the thickness of plate is 1.5 mm, the pressure is 0.15 MPa. According to the optimum process parameters, the quality of the honeycomb plate bonding at the room temperature meet the requirements of aerospace, which is similar to that bonding with heating.

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History
  • Received:April 08,2018
  • Revised:
  • Adopted:
  • Online: April 02,2019
  • Published: