Selective Wave Soldering Processing Technology of Short-Lead PGA
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TN6;TG4

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    Abstract:

    For the PGA package device leads in the assembly process is too short, the short-lead PGA is tested by selective wave soldering after analyzing the three main welding methods to optimize the welding process parameters, and the welding quality is discussed by looking at the appearance, X-ray and metallographic. The conclusion can be made that after visual inspection and X-rays inspection, no obvious solder joints defects are found in the short-lead PGA solder joints by selective wave soldering.The metallographic map of the solder joints show good welding at the joint,and meet the requirements of qualified intermetallic compound thickness. The selective wave soldering process method can realize short-lead PGA welding and has certain application value.

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History
  • Received:April 14,2018
  • Revised:
  • Adopted:
  • Online: June 04,2018
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