Non-Isothermal Curing Kinetics of An 80℃ Curing Epoxy Resin System
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TQ320.1

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    Abstract:

    DSC was used to study the non-isothermal curing kinetics of an 80℃ curing epoxy resin system(LTCEP),and the sum model coupling the Gaussian distribution and the Lorentzian distribution was used to simulate the DSC peaks. Afterwards the variation of activation energy versus conversion and the non-isothermal curing kinetics for each stage of the curing reaction were studied by the Flynn-Wall-Ozawa method and a model-fitting Málek approach, respectively.The overall reaction rate was obtained according to the peak fit results and then the isothermal curing behaviors at different temperatures were predicted.Finally, tensile experiment is performed to investigate the tensile properties of LTCEP.The peak fit analysis indicated that each DSC curve could be well simulated by using three Gaussian-Lorentzian components.Afterwards the non-isothermal kinetics investigation revealed that the variation of activation energy versus conversion for each stage of the curing reaction changed insignificantly and the curing rates of each stage could be well described by the Šesták-Berggren model. Moreover,it is predicted from the overall reaction rate that the conversion of LTCEP would be up to 90% when this resin system was cured at 150℃ for 3 min or 140℃ for 5.5 min.The tensile test at room temperature showed that the tensile strength and the elongation at break of LCTEP cured at 80℃ for 8 h are respectively 51.34±11.78 MPa and 1.23%±0.34%,and the tensile properties did not change significantly after the post treatment on the samples at 125℃.

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History
  • Received:August 09,2016
  • Revised:March 03,2017
  • Adopted:
  • Online: June 06,2017
  • Published: