Drilling Process For SiCf/SiC Ceramic Matrix Composites
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(AVIC Composite Corporation Ltd., Beijing 101300)

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TB332

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    Abstract:

    SiCf/SiC composites were drilled by machining process and laser process. The quality of holes and the characteristics of the two processes were analysed. The results show that machining drilling can get holes with better diameter but there are serious tool wear, burr side damage problems. Laser drilling has a better efficiency but there is taper hole and the existence of heat affected zone of wall surface causes defects such as delamination and crack.

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History
  • Received:November 14,2015
  • Revised:
  • Adopted:
  • Online: January 11,2017
  • Published: