Simulation and Analysis on Temperature Field of Frame Mold in Autoclave Process
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1.Nanjing University of Aeronautics and Astronautics,Nanjing 210016;2.Key Lab. of High Performance Electromagnetic Window for Aviation Science and Technology,Jinan 250000

Clc Number:

V261.97

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    Abstract:

    In order to study the temperature field of the mold for forming composite material components,this article takes the autoclave curing process of a certain type of aircraft wall as an example.Through model simplification,a numerical simulation model of the mold temperature field is established by using simulation software such as FLUENT,and the simulation data and experiments are used for comparison.The results show that the average relative error is 7.4%.In addition,a set of examples with the thickness of the support plate as a variable and two control groups with the thickness of the support plate in the U and V directions were simulated.By judgment the surface temperature variance of the mold plate,the effect law of the thickness of the support on the influence of mold temperature field distribution plate was studied.The results show that the uniformity of the mold temperature field gradually decreases with the increasing of the thickness of the support plate,and the change of the thickness of the support plate in U direction has a greater effect on the uniformity of the temperature field than that in the V direction.

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History
  • Received:August 06,2019
  • Revised:
  • Adopted:
  • Online: February 17,2020
  • Published: