基于VCCT 技术的粘胶脱粘过程数值仿真研究

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基于VCCT 技术的粘胶脱粘过程数值仿真研究
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作者单位:上海交通大学
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中图分类号:V257
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Numerical Simulation of Adhesive Debonding Process Based on VCCT

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摘要:

由于粘胶位于两层材料中间,胶粘结构的内部脱粘过程通常难以检测。本文通过制备三种粘胶

的粘胶片体试样以及U 型件试样,对粘胶在拉伸及剪切状态下的力学性能进行测试,并计算获得对应的应变

能释放率。采用VCCT 技术,预设断裂及脱粘区域,对粘胶在单拉及剪切受力状态下的开裂及脱粘过程进行数

值仿真。通过对比数值仿真与实验获得的最大应力及最大位移,验证了VCCT 技术能有效获得这三种粘胶的

断裂临界载荷,并表明这种方法能获得脱粘区域的扩展过程,为研究复杂结构的脱粘过程奠定了基础。

Abstract:

Since the adhesive is located between two layers of material, the internal structure of the adhesive

debonding process is often difficult to detect. In this paper, three kinds of adhesives’ plate samples and the Ushaped

samples were made, the mechanical properties of tensile and shear state were tested and the corresponding

strain energy release rate were calculated. VCCT technology was used, the fracture and debonding area were predefined,

the cracking and debonding process of the adhesive in a tensile and shearing state were simulated. By contrasting

the maximum stress and maximum displacement obtained by numerical simulation and experiments, it was indicated

that the VCCT technology could effectively predict fracture critical load of these three adhesive, and show that this

method could obtain the expansion process of debonding area. This laid a good foundation for the study of complex

structures’ debonding process.

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王闪帅.基于VCCT 技术的粘胶脱粘过程数值仿真研究[J].宇航材料工艺,2014,44(6).

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在线发布日期: 2016-11-28
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