The relationship between microstructure and properties of insulating materials was investigated. The
results indicate that the thermal conductivity and mechanical property of insulating materials increases with the in鄄
crease of density. Microstructure and properties between in鄄plane and transverse orientation of rigid tile is different.
Insulation property of rigid tile is better after compositing process,thermal conductivity reduces from 43 mW/ (m·K)
to 36 mW/ (m·K). After adding functional agent, insulation property at high temperature is better, backside temper鄄
ature of sample reduces from 668益to 576益. But dielectric constants increases by 2% to 6. 6%. Waterproofing and
low moisture absorption insulating materials is gained after special process.