哈尔滨工业大学复合材料研究所
采用粉末包埋法对电子束物理气相(EB-PVD)制备钛合金薄板在620℃分别进行6h渗铝及铝硅共渗,采用XRD、SEM 等对EB-PVD制备钛合金薄板显微组织以及粉末包埋法渗铝及Al-Si共渗后的钛合金薄板显微组织结构进行研究。结果表明,微晶合金可以在620℃实现渗铝和铝硅共渗。渗铝层的相结构主要为Al3Ti相,但由于渗层Al3Ti相为脆性相,在渗后冷却过程中热应力的作用下,易产生裂纹。铝硅共渗层的相结构主要为Al3Ti和Ti5Si3相,由于Si存在渗层中,渗层中不存在裂纹。
Thepackaluminizedandsiliconaluminizedat620℃for6hoursonTi-alloysheetfabricatedbyelectronbeamphysicalvapordeposition (EB-PVD)techniquewasinvestigated.Surfacesandcross-sectionsofthealuminizedspecimenswerestudiedbyscanningelectronmicroscopy(SEM).PhaseidentificationoftheoxidescalewasperformedbyX-raydiffraction (GAXRD)andenergydispersiveanalysisofX-rays (EDAX).Theresultsshowthataluminizingcouldbecarriedoutat620℃.ThephaseconstructionofthealuminizedcoatingisAl3Ti.However,asAl3Tiphaseisbrittle,itiseasytocreatecrackinthecoolingprocessduetotheheatstress.AfterAl-Sico-infiltrationat620℃,thephasesofthecoatingareAl3TiandTi5Si3.Theinterfaceisclearbutunsmooth.
卢 亮 李明伟 赫晓东.微晶钛合金薄板粉末包埋渗铝及铝硅共渗研究[J].宇航材料工艺,2011,41(6).