Properties of SiCp / Al Electronic Packaging SubstratesFabricated by Pressureless Infiltrating
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摘要:
采用无压浸渗法制备出电子封装用高体积分数SiCp / Al 复合材料基板,研究了主要合金元素对 浸渗过程的影响和SiC 体积分数对复合材料热物理性能的影响。结果表明:合金中Mg 元素能促进界面润湿, Si 元素能减小有害界面反应的发生;随着SiC 体积分数的增加,复合材料的热导率和线胀系数都呈下降趋势, 当SiC 体积分数为65%左右,热导率下降幅度减缓;当SiC 体积分数为68%左右时,线胀系数显著降低。
Abstract:
Silicon carbide particle reinforced aluminum composite SiCP / Al was fabricated by pressureless infil tration technology. The effects of alloying elements on infiltration process were studied. The influence of SiC volume fraction on thermo physical properties of composite was investigated as well. It was found that magnesium improved in terface wettability and silicon depressed the harmful interface reaction. With the increasing of SiC volume fraction, the values of thermal conductivity and linear expansion coefficient of the composite decreased. When the SiC volume frac tion approached 65 percent, the decrease of thermal conductivity slowed down. When the SiC volume fraction approached 68 percent, linear expansion coefficient rapidly decreased.
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黄俊 王晓刚 朱明 王明静 任怀艳.无压浸渗法制备SiCp / Al 电子封装基板及其性能[J].宇航材料工艺,2011,41(3).