Aiming at the problem of low tolerance of electronic products under high overload environments，an epoxy encapsulant with excellent performance was investigated and prepared.ANSYS 19.2 software was employed to conduct simulation analysis on the product assembly under a 20 000 g impact condition，and the equivalent stress distribution of BGA solder balls under different reinforcement schemes was calculated.The results show that the equivalent stress exerted on the solder balls is minimized in the assembly using both underfill and encapsulant simultaneously.The simulation results are verified through reliability tests and analyses.Experimental results demonstrate that the combined application of underfilling and encapsulation reinforcement can effectively improve the reliability of electronic products in a 20 000 g high overload environment.