A summary of failure analysis cases for chip thick film resistors and resistor arrays is presented.The primary failure modes observed are open circuits and resistance value changes.Eight causes leading to open circuits and resistance variations are illustrated through practical examples.Utilizing testing methods such as optical microscopy，scanning electron microscopy，and energy dispersive spectroscopy，the analysis approach for thick-film resistors is categorized from failure phenomena to specific analytical processes.The fundamental sequence for failure analysis in these products is established as proceeding from the exterior to the interior.