In order to study the effect of grinding process parameters on the grinding temperature of C/C-SiC composites， a three-factor four-level orthogonal experiment was to investigate the influence of different grinding parameters on the grinding temperature. The range analysis method was used to evaluate the degree of influence of relevant process parameters on the grinding temperature， and a comparison was made between the grinding temperatures under dry grinding and minimum quantity lubrication （MQL） grinding. The results show that MQL grinding can reduce the grinding temperature and improve surface machining quality； in dry grinding， the order of parameters influence on temperature is grinding depth， wheel peripheral speed， and table feed rate， whereas under MQL grinding， the influence order is wheel peripheral speed， grinding depth， and table feed rate.