In order to meet the design requirements of low loss，fused quartz substrate was commonly used in terahertz microwave modules.Different from the requirements of optical system for fused quartz materials， the fused quartz substrate materials used in terahertz high frequency microwave modules not only need to have stable dielectric properties， but also need better surface coating characteristics and processing accuracy such as circuit graphics and shape. Based on the thin film circuit manufacturing process requirements， the key technologies of the coating adhesion，surface etching precision， cutting quality， bonding strength characteristics of the JC-Z05 quartz substrate were researched.By improving the process parameters， the technology applicability of the JC-Z05 quartz substrate was further improved.At the same time， the thin film circuit reliability of the domestic quartz substrate materials was improved in the terahertz frequencies fields. The results show that the circuit made by fused quartz substrate， combined with the optimized manufacturing process of thin film circuit， has the characteristics of strong adhesion of film layer， small shape cutting tolerance and high bonding reliability，which can meet the high reliability application in complex aerospace environment. The good suggestions for the subsequent application of fused quartz substrate in the field of terahertz are provided in this word.