Some CCGA Packages using on aerospace products should be assembled after PCB assembling for Space Applications by using infrared-hot flow hybrid SMT rework platform. This paper studied the temperature-control procedure, welded CCGA chips, and tested the assembling reliability. It confirmed the temperature control position should be located at 1-2mm from the edge of CCGA chips. The results proposed a simple and effective method to control the high thermal area(＞183 ℃). The results indicate that temperature curve range is feasible and there is no crack by dyeing experiment. The microstructure analysis by SEM and EDS indicates the thickness of IMC layer is uniform. There is no any crack inside the solder joint after reliability tests. This study standardized the soldering procedure of CCGA Packages after PCB assembling for Space Applications, the results indicate temperature-control method in this paper is reasonable and feasible. This method improved the reliability of CCGA solder point. It can be used on chips’ reworking and welding on aerospace products.