This study investigates the thermal residual stress distribution in TA2/PEEK/CF laminates with interlayer micro-pit arrays through thermal release experiments and finite element simulations.The effects of micro-pit depth，diameter，and center distance on thermal stresses in different regions before and after bending forming are systematically analyzed.Key findings include：For unbent laminates， thermal stress initially decreases and then increases with micro-pit depth，while reducing center distance significantly lowers stress.The diameter shows minimal influence，as thermal stress is dominated by thickness-direction changes caused by thermal expansion mismatch.Post-bending，thermal stress in plastic deformation zones increases with reduced center distance，with comparable impacts from depth and diameter.Micro-pits enhance forming accuracy but elevate localized stress due to increased plastic deformation.In elastic deformation zones，thermal stress decreases notably with smaller center distance，while diameter exerts a stronger influence than depth.Stress relief first improves and then deteriorates with deeper pits.Optimized micro-pit parameters （depth 60 μm， diameter 550 μm，center distance 730 μm） effectively mitigate thermal stress in pre-bending layers and post-bending elastic zones，albeit with increased stress in metal layers of plastic zones.The study reveals the dual role of micro-pits in regulating stress distribution and plastic deformation behavior，offering practical insights for optimizing laminate fabrication and micro-pit design.