In order to solve the problem that it is difficult to control the interface between conductive layer and dielectric layer in the process of manufacturing electromagnetic metamaterials by inkjet printing technology，by changing the printing temperature of dielectric material substrate （80，100，120 ℃） and the thickness of conductive layer （5，10，15，20 μm），the interface morphology，interface bonding force and conductivity of conductive layer were tested and characterized，so as to study the influence of interface behavior between conductive layer and dielectric layer. The results show that the interface behavior between the conductive layer and the dielectric layer is affected by multiple factors such as the substrate printing temperature and the thickness of the conductive layer.The continuous increase of the printing temperature of the dielectric substrate will lead to the continuous improvement of the conductivity of the conductive layer， but it will also cause the interfacial bonding force to increase at first and then decrease，mainly because too high temperature will lead to interfacial stress and excessive solidification.Therefore，it can provide the best interfacial bonding behavior when the dielectric substrate is printed at 100 ℃.The increase of the thickness of the conductive layer can lead to the continuous enhancement of electrical conductivity，but on the whole，it leads to the weakening of the interfacial adhesion.When the printing temperature of the dielectric substrate is 100 ℃，the optimal thickness of the conductive layer is 15 μm， the bonding force is classified as grade 1，and the resistivity is 3.27 mΩ·cm.