Based on the curing mechanism of bismaleimide resin，dynamic in-situ curing programs were developed to simulate the pre-polymerization and crosslinking of bismaleimide，a two steps method was used to construct a molecular dynamic （MD） model of high temperature resistant bismaleimide resin，and predictions were made regarding its model structure，thermomechanical properties，and resin stiffness.The curing reaction conversion rate and the density of the curing model during the pre-polymerization and crosslinking process of bismaleimide resin are consistent with the actual values，proving that the dynamic in-situ curing program achieves the curing program achieved the curing reaction of the experimental process.Meanwhile，during the simulated curing process from resin precursor to per-polymer to crosslinked model，the resin model gradually transitions from a high-viscosity liquid state to a high-density network structure solid polymer state，verifying the rationality of the curing program.The predicted glass transition temperature and Yong’s modulus based on the density，volume change rate，and elastic stiffness matrix of the bismaleimide resin curing model are close to the experimental results，confirming the reliability of the this bismaleimide resin model and its suitability for the bismaleimide resin system.