HIT-J01 腻子的制备及性能

HIT-J01 腻子的制备及性能
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作者单位:哈尔滨工业大学化工学院
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Preparation and Properties of HIT-J01 Putty

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摘要:

采用有机硅树脂掺杂无机粒子制备了一种耐高温腻子(HIT-J01),研究了其粘接性能、膨胀特性

和抗热震性能。通过SEM 及XRD 分析了腻子的微观结构和相变化。结果表明:制备的腻子具有良好的粘接

和抗热震性能,粘接C/ SiC 的单搭接剪切强度为5. 5 MPa,1 200℃在线单搭接剪切强度1. 8 MPa。腻子同基材

C/ SiC 具有良好的热膨胀匹配性能。HIT-J01 腻子在高温条件下生成的Al2O3·(B2O3 )n 融体。在风洞考核环

境下,腻子封堵面平均温度高达1 200℃,最高温度达到1 400℃,风洞实验后,腻子表观平整、无裂纹。

Abstract:

A heat-resistant putty for sealing ceramics was prepared by dopping organic silicone with inorganic

particles. The adhesion properties, coefficient of thermal expansion and thermal shock resistance were studied. SEM

and XRD were used to analysis microstructure and phases. The results show that heat-resistant putty has excellent adhesion

and thermal shock resistance. While bonding C/ SiC, the single lap shear strength is 5. 5 MPa, and 1. 8 MPa

at 1 200℃. The putty can also bond and seal multiple materials such as the aerogel,C/ C materials. The putty has

characteristic of low expansion, and with good thermal expansion match withl C/ SiC. At high temperatures, the putty

generated Al2O3·(B2O3)n . It can absorb thermal shock, and can enhance interface strength. At the wind tunnel environment,

average surface temperature is 1 200℃,and maximum temperature is 1 400℃. The apparece of specimens

is complete with no cracking after the wind tunnel test.

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引证文献

钟正祥. HIT-J01 腻子的制备及性能[J].宇航材料工艺,2015,45(4):40-42.

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