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基于数值模拟的印制电路板低透锡率焊盘焊接温度分析
王海超,施海健,丁颖洁,马力
上海航天控制技术研究所,上海 201100
摘要:
部分印制电路板通孔焊盘与接地层连接,手工焊接过程中接地层散热严重,焊点透锡率不足。为解决此问题,通过ABAQUS软件计算多层印制板手工焊接普通焊盘、低透锡率焊盘的温度分布情况,分析整板预热对温度及透锡率的影响。分析结果显示,未预热状态下低透锡率焊盘的镀铜层散失热量约为普通焊盘孔的4倍,低透锡率焊盘孔非焊接面温度为125~126℃,远低于锡铅共晶焊料熔点(183℃);预热85、100、115℃情况下低透锡率焊盘非焊接面温度分别提高至171.5、179、187.5℃。模拟与实验结果表明,整板预热85~115℃可有效改善通孔焊盘透锡率、提高焊点服役可靠性。
关键词:  数值模拟  温度分布  热流密度  透锡率
DOI:10.12044/j.issn.1007-2330.2020.04.006
分类号:0242.1
基金项目:
Temperature analysis of Low Tin-permeability-rate Pads of Printed Circuit Board Based on Numerical Simulation
WANG Haichao, SHI Haijian, DING Yingjie, MA Li
Shanghai Aerospace Control Technology Institute,Shanghai 201100
Abstract:
Some through hole pads of printed circuit board connected to ground layer. Large heat dissipation in ground layer would lead to low solder tin-permeability rate during the manual welding process. To solve the problem, temperature distribution of common and low tin-permeability rate pads was calculated by ABAQUS software. And the influence of whole board preheating on the peak temperature and permeability rate was analyzed. The results show that without preheating printed circuit board, the heat dissipation in ground layer is 4 times as that of the common through hole pads. The peak temperature of non-welded surface of low tin-permeability rate pads is 125~126 ℃, which was far lower than the melting point of the tin-lead eutectic solder (183 ℃). When printed circuit board is preheated to 85,100 and 115 ℃, the peak temperature of non-welded surface of low tin-permeability rate pads is increased to 171.5,179 and 187.5 ℃, respectively. Simulation and experimental results indicate that preheating Printed Circuit Board at 85~115 ℃ is beneficial to improve the permeability rate and solder-joint reliability of Sn-Pb eutectic solder.
Key words:  Numerical thermal simulation  Temperature filed  Heat flux density  Permeability-rate