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电子产品中铅焊接金脆问题浅析
周传君1,周岭1,马娜1,王智斌1,张绍东1
航天东方红卫星有限公司,北京 100094
摘要:
针对航天电子产品广泛采用的Sn-Pb焊料在镀金表面焊接形成焊点的工艺,分析了工业及国内外航天相关标准文件中对焊接后焊点中含金量的要求以及焊点含金量、时效、器件不同封装形式对焊点可靠性的影响,并深入分析了合金焊点金相组织结构,最后介绍了一般去金工艺要求与去金不到位而导致器件失效案例。
关键词:  金脆  含金量  时效  器件封装  去金
DOI:10.12044/j.issn.1007-2330.2019.04.002
分类号:590.4510
基金项目:
Analysis of Gold Brittlement Poblem With Lead Soldering of Electronic Product
ZHOU Chuanjun1,ZHOU Ling1,MA Na1,WANG Zhibin1,ZHANG Shaodong1
DFH Satellite Co.,Ltd,Beijing 100094
Abstract:
The process of solder joints on the gold-plated surface of Sn-Pb solder was widely used in aerospace electronics. The requirements of gold content in solder joints after welding in industrial documents and domestic and foreign standards were analyzed. The influences of solder gold content, aging and different packaging forms on reliability of solder joints were analyzed and the metallographic structure of solder joints was discussed. Finally, the requirements of de-golding and failure case of inadequate de-golding were introduced.
Key words:  Gold embrittlement  Gold content  Timeliness  Packaging  De-gold