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CCGA封装芯片落焊控温工艺研究
王海超,丁颖洁,栾时勋,彭小伟
上海航天控制技术研究所,上海 201100
摘要:
部分宇航型号单机生产过程中,CCGA芯片因软件固化、调试等原因需使用返修台进行落焊,落焊温度曲线直接影响CCGA器件及周围器件的装配可靠性。本文使用红外热风混合型返修台进行CCGA落焊控温工艺研究,并进行焊接及可靠性试验验证。研究发现,返修台控温点距离器件边缘1-2mm时温度反馈控制效果最佳;本文提出了增加导热挡板控制高温区范围(>183 ℃)的新方案,可将高温区控制在落焊位置周围8mm范围内;CCGA焊接样件分析显示焊锡柱侧微观组织呈块状,IMC层组织均匀,未出现Cu3Sn脆化物,可靠性试验后染色浸润测试发现焊点完好,未出现裂纹。结果证明所本文提出的温度控制工艺合理有效,可应用于宇航产品落焊过程。
关键词:  CCGA封装芯片,落焊,温度控制,可靠性,微观组织
DOI:10.12044/j.issn.1007-2330.XXXX.XX.001
分类号:TG454
基金项目:
Board-soldering temperature control process of CCGA Packages after PCB assembling for Space Applications
WANG Haichao, DING Yingjie, LUAN Shixun, PENG Xiaowei
Shanghai Aerospace Control Technology Institute, shanghai, Shanghai 201100
Abstract:
Some CCGA Packages using on aerospace products should be assembled after PCB assembling for Space Applications by using infrared-hot flow hybrid SMT rework platform. This paper studied the temperature-control procedure, welded CCGA chips, and tested the assembling reliability. It confirmed the temperature control position should be located at 1-2mm from the edge of CCGA chips. The results proposed a simple and effective method to control the high thermal area(>183 ℃). The results indicate that temperature curve range is feasible and there is no crack by dyeing experiment. The microstructure analysis by SEM and EDS indicates the thickness of IMC layer is uniform. There is no any crack inside the solder joint after reliability tests. This study standardized the soldering procedure of CCGA Packages after PCB assembling for Space Applications, the results indicate temperature-control method in this paper is reasonable and feasible. This method improved the reliability of CCGA solder point. It can be used on chips’ reworking and welding on aerospace products.
Key words:  CCGA Packages, Board-soldering procedure, Temperature-control method, Solder joint reliability, Microstructure