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酚醛树脂基泡沫碳材料的烧蚀与隔热性能
殷忠义1,雷玥2,郑金煌2
1.中国电子科技集团公司第三十八研究所,合肥 230088;2.西安航天复合材料研究所,西安 710025
摘要:
为考察纳米孔径的酚醛树脂基泡沫碳材料的烧蚀与隔热性能,以酚醛树脂为碳源,环戊烷为发泡剂,吐温80为表面活性剂,对甲苯磺酸为固化剂,采用发泡固化碳化工艺制备了低密度泡沫碳材料。所制备的泡沫碳材料密度为0.3 g/cm3,压缩强度达到了11.7 MPa。采用LFA457激光导热仪考察了泡沫碳材料在不同温度下(25、200、400、600 ℃)的导热性能,25 ℃下热导率为0.141 W/(m·K),600 ℃下热导率为0.344 W/(m·K);通过氧乙炔试验(30 s/60 s)对泡沫碳材料与C/C复合材料在同样的气流条件下隔热性能进行了比较,在材料正面烧蚀峰值温度泡沫碳材料比C/C复合材料高出约400 ℃的情况下,背面峰值温度比C/C复合材料仍低出150 ℃;通过氧乙炔试验考察泡沫碳材料的抗烧蚀性能,氧乙炔烧蚀60 s的线烧蚀率为0.031 mm/s。试验结果证明低密度的泡沫碳材料同时具备优异的隔热与高温抗烧蚀性能。
关键词:  泡沫碳  氧乙炔  线烧蚀率  热导率
DOI:10.12044/j.issn.1007-2330.2020.02.009
分类号:TB33
基金项目:
Oxyacetylene Torch Testing and Thermal Insulation Property of Phenolic Carbon Foam
YIN Zhongyi1, LEI Yue2, ZHENG Jinhuang2
1.The 38th Research Institute of CETC,Hefei 230088;2.Xi'an Aerospace Composite Research Institute,Xi'an 710025
Abstract:
The present paper is concerned with the thermal insulation property and evaluation of ablative performance of phenolic resin based carbon foam,which is prepared from phenolic resin,cyclopentane,tween-80 and P-toluenesulfonic via processes of foaming, solidifying and carbonization.The thermal insulation properties of carbon foam are investigated at 25 ℃,200 ℃,400 ℃ and 600 ℃ by LFA457 laser flash apparatus , while ablation resistance behaviors of carbon foam are studied using a custom built oxyacetylene torch test facility and the results are compared with that of C/C composites. The results show that thermal conductivity of carbon foam whose density and compressive strength of carbon foam are 0.3 g/cm3 and 11.7 MPa,respectively is 0.141 W(/ m·K)and 0.344 W(/m·K) at 25 ℃ and 600 ℃.The liner ablation rate of carbon foam is 0.03 1mm/s, and the back-face peak temperature of carbon foam is about 150 ℃ lower than C/C composites.On the contrary,the front-face peak temperature of carbon foam is about 400 ℃ higher than C/C composites.The conclusion is drew that carbon foam with low density has excellent thermal insulation property and ablation resistance behavior.
Key words:  Carbon foam  Oxyacetylene torch testing  Liner ablation rate  Thermal conductivity